NSN 5961-01-374-7152 01-374-7152, 013747152
Product Details | UNITIZED SEMICONDUCTOR DEVICES
5961-01-374-7152 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.
Part Alternates: 5961-01-374-7152, 01-374-7152, 5961013747152, 013747152
Electrical and Electronic Equipment Components | Semiconductor Devices and Associated Hardware
| Supply Group (FSG) | NSN Assign. | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | 01-374-7152 | 61962 ( SEMICONDUCTOR DEVICES, UNITIZED ) |
Cross Reference | NSN 5961-01-374-7152
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| HSMS-2812-L | 28480 | HEWLETT-PACKARD COMPANY DBA HEWLETT-PACKARD CO. OR HP |
| HSMS-2812BLK | 28480 | HEWLETT-PACKARD COMPANY DBA HEWLETT-PACKARD CO. OR HP |
| HSMS-2812BLK | 50434 | AVAGO TECHNOLOGIES U.S. INC. DIV AVAGO TECHNOLOGIES |
| HSMS-2812T30 | 28480 | HEWLETT-PACKARD COMPANY DBA HEWLETT-PACKARD CO. OR HP |
| HSMS-2812T31 | 50434 | AVAGO TECHNOLOGIES U.S. INC. DIV AVAGO TECHNOLOGIES |
| HSMS-2812T31 | 54893 | HEWLETT-PACKARD CO COMMUNICATIONS COMPONENTS/AVANTEK DIV |
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Technical Data | NSN 5961-01-374-7152
| Characteristic | Specifications |
|---|---|
| COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| SEMICONDUCTOR MATERIAL | SILICON SINGLE SEMICONDUCTOR DEVICE DIODE |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 20.0 MINIMUM BREAKDOWN VOLTAGE, INSTANTANEOUS AND 1.0 MAXIMUM FORWARD VOLTAGE, DC SINGLE SEMICONDUCTOR DEVICE DIODE |
| CURRENT RATING PER CHARACTERISTIC | 15.00 MILLIAMPERES NOMINAL FORWARD CURRENT, DC SINGLE SEMICONDUCTOR DEVICE DIODE |
| POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS NOMINAL TOTAL POWER DISSIPATION SINGLE SEMICONDUCTOR DEVICE DIODE |
| CAPACITANCE RATING IN PICOFARADS | 1.2 MINIMUM SINGLE SEMICONDUCTOR DEVICE DIODE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| INCLOSURE MATERIAL | PLASTIC |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-23 |
| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| OVERALL LENGTH | 0.110 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| OVERALL HEIGHT | 0.033 INCHES MINIMUM AND 0.047 INCHES MAXIMUM |
| OVERALL WIDTH | 0.047 INCHES MINIMUM AND 0.055 INCHES MAXIMUM |
Restrictions/Controls & Freight Information | NSN 5961-01-374-7152
| Category | Code | Description |
|---|---|---|
| Hazardous Material Indicator Code | N | There is no data in the HMIS and the NSN is in an FSC not generally suspected of containing hazardous materials |
| Category | Code | Description |
|---|---|---|
| No Freight Information | ||



