Product Details | MEMORY MICROCIRCUIT

5962-01-097-3898 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Part Alternates: CC1241, ROM/PROM, ROMPROM, 82S123/BEA, 82S123BEA, 581R504H02, 5962-01-097-3898, 01-097-3898, 5962010973898, 010973898

Electrical and Electronic Equipment Components | Microcircuits, Electronic

Supply Group (FSG) NSN Assign. NIIN
59 10 JUL 1980 01-097-3898

Cross Reference | NSN 5962-01-097-3898

Part Number Cage Code Manufacturer
581R504H02 18324 PHILIPS SEMICONDUCTORS INC
581R504H02 97942 NORTHROP GRUMMAN SYSTEMS CORPORATION DIV NORTHROP GRUMMAN SYSTEMS
82S123/BEA 18324 PHILIPS SEMICONDUCTORS INC
CC1241 18324 PHILIPS SEMICONDUCTORS INC
ROM/PROM 16236 DLA LAND AND MARITIME

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Technical Data | NSN 5962-01-097-3898

Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 6 INPUT
(NON-CORE DATA) BIT QUANTITY 256
VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE
TIME RATING PER CHACTERISTIC 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATOR D-2 MIL-M-38510
BODY LENGTH 0.840 INCHES MAXIMUM
BODY HEIGHT 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND W/DISABLE AND W/ENABLE AND 3-STATE OUTPUT
TEST DATA DOCUMENT 97942-581R504 DRAWING
III UNPACKAGED UNIT WEIGHT 2.5 GRAMS

Restrictions/Controls & Freight Information | NSN 5962-01-097-3898

Category Code Description
Hazardous Material Indicator CodeNThere is no data in the HMIS and the NSN is in an FSC not generally suspected of containing hazardous materials
Demilitarization Code:DMunitions List Item or Commerce Control List Item. Demilitarization required. Total destruction of the item and components so as to preclude restoration or repair to a usable condition by melting, cutting, tearing, scratching, crushing, breaking, punching, neutralizing, etc. (As an alternate, burial or deep water dumping may be used when coordinated with the DoD Demilitarization Program Office.)
Electro-static Discharge Susceptible:DBoth ESD and EMI sensitivity
Precious Metals Indicator Code:AItem does not contain precious metal
Criticality Code:X The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.
Automatic Data Processing Equipment:0Represents items with no ADP components. NOTE: Codes 1 through 6 are only to be used when the item is Automatic Data Processing Equipment (ADPE) in its entirety and is limited to the type meeting only one of the definitions for codes 1 through 6. (See code 9)
Category Code Description
NMF Description 061700 ELEC APPLIANCES/INSTRUMENTS NOI
Less than car load rating
Less than truck load rating W Rating Variable
Water commodity Code 72D unknown
Originating Activity Code TX Defense Supply Center Columbus
Columbus, OH 43218
Air Dimension Code A Shipment is not a consolidation and does not exceed 72 inches in any dimension.
Air Commodity H Signal Corps supplies and equipment, including radio equipment and supplies, communications equipment and supplies, electrical equipment and supplies, etc.
Air Special Handling Z No special handling required.
Special Handling Code 9 unknonwn
HAZMAT
Type of Cargo 3 Electrostatic Sensitive Device (ESD), subject to damage caused by electrostatic discharge. (See DoD 4500.32-R, Volume 1, Appendix A, Section I for additional information on ESD devices).