NSN 5962-01-186-8333 AD5215TD/883B, AD5215TD883B, B97003
Product Details | DIGITAL MICROCIRCUIT
5962-01-186-8333 A microcircuit specifically designed to generate, modify, or process electrical signals which operate with two distinct or binary states. These states are commonly referred to as on and off, true and false, high and low, or "1" and "0".
Part Alternates: AD5215TD/883B, AD5215TD883B, B97003, 5962-01-186-8333, 01-186-8333, 5962011868333, 011868333
Electrical and Electronic Equipment Components | Microcircuits, Electronic
| Supply Group (FSG) | NSN Assign. | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | 15 AUG 1984 | 01-186-8333 | 31779 ( MICROCIRCUIT, DIGITAL ) |
Demand History | NSN 5962-01-186-8333
| Part Number | Request Date | QTY | Origin |
|---|---|---|---|
| 5962-01-186-8333 | 2009-07-208 | 100 | US |
| 5962-01-186-8333 | 2009-07-191 | 1 | US |
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Technical Data | NSN 5962-01-186-8333
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| DESIGN FUNCTION AND QUANTITY | 1 CONVERTER, ANALOG TO DIGITAL |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| (NON-CORE DATA) BIT QUANTITY | 12 |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| BODY LENGTH | 1.200 INCHES NOMINAL |
| BODY HEIGHT | 0.085 INCHES NOMINAL |
| BODY WIDTH | 0.590 INCHES NOMINAL |
| MAXIMUM POWER DISSIPATION RATING | 575.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND MONOLITHIC |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| III UNPACKAGED UNIT WEIGHT | 6.5 GRAMS |
Restrictions/Controls & Freight Information | NSN 5962-01-186-8333
| Category | Code | Description |
|---|---|---|
| Hazardous Material Indicator Code | N | There is no data in the HMIS and the NSN is in an FSC not generally suspected of containing hazardous materials |
| Demilitarization Code: | D | Munitions List Item or Commerce Control List Item. Demilitarization required. Total destruction of the item and components so as to preclude restoration or repair to a usable condition by melting, cutting, tearing, scratching, crushing, breaking, punching, neutralizing, etc. (As an alternate, burial or deep water dumping may be used when coordinated with the DoD Demilitarization Program Office.) |
| Electro-static Discharge Susceptible: | B | ESD sensitivity |
| Precious Metals Indicator Code: | A | Item does not contain precious metal |
| Criticality Code: | X | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| Automatic Data Processing Equipment: | 0 | Represents items with no ADP components. NOTE: Codes 1 through 6 are only to be used when the item is Automatic Data Processing Equipment (ADPE) in its entirety and is limited to the type meeting only one of the definitions for codes 1 through 6. (See code 9) |
| Category | Code | Description |
|---|---|---|
| NMF Description | 061700 | ELEC APPLIANCES/INSTRUMENTS NOI |
| Less than car load rating | ||
| Less than truck load rating | W | Rating Variable |
| Water commodity Code | 72D | unknown |
| Originating Activity Code | TH | Defense Supply Center Columbus Columbus, OH 43215 |
| Air Dimension Code | A | Shipment is not a consolidation and does not exceed 72 inches in any dimension. |
| Air Commodity | H | Signal Corps supplies and equipment, including radio equipment and supplies, communications equipment and supplies, electrical equipment and supplies, etc. |
| Air Special Handling | Z | No special handling required. |
| Special Handling Code | 9 | unknonwn |
| HAZMAT | ||
| Type of Cargo | 3 | Electrostatic Sensitive Device (ESD), subject to damage caused by electrostatic discharge. (See DoD 4500.32-R, Volume 1, Appendix A, Section I for additional information on ESD devices). |